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Encapsulants and Potting Materials
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Encapsulants and Potting Materials
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DOWSIL™ TC-6015 Thermal Conductive Encapsulant
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Loctite Eccobond UF 3810
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Loctite Eccobond UF 3808
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TECHNOMELT® AS 4226
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TECHNOMELT® PA 2384
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TECHNOMELT® PA 6344
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Technomelt PA 668 – Low pressure molding
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Dow Corning® 7920 Die Attach Adhesive
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Dow Corning® CN-8760 A&B Kit
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