Description
BERGQUIST GAP FILLER TGF 1450 is a two-part liquid gap filling system that cures at room temperature to form a strong, mouldable elastomer that is ideal for fragile assemblies.
BERGQUIST® GAP FILLER TGF 1450 is a liquid gap filling material that provides a high level of control due to its high shear thinning characteristics and dries with a low density to reduce final assembly weight. The mixed system remains ultra-conforming with excellent wet-out for near zero interface stress and offers infinite thickness variations without adding stress to the sensitive components during or following assembly.
- Thermal conductivity: 1.5 W/m-K
- No cure by-products
- Ultra-conforming with excellent wet-out for near zero interface stress
- Low density for weight sensitive application
| Density | 1.85 g/cm³ |
| Dielectric Constant, ASTM D150 @ 1kHz | 6.4 |
| Flame Rating | V-0 |
| Heat Capacity, ASTM E1269 | 1.0 J/g-K |
| Mix Ratio, by Volume | 1 : 1 |
| Mix Ratio, by Weight | 1 : 1 |
| Pot Life, @ 25.0 °C | 60.0 min. |
| Shelf Life | 6.0 mon. |
| Shore Hardness, Thirty second delay value, ASTM D2240 Shore 00 | 40.0 |
| Storage Temperature | 25.0 °C |
| Thermal Conductivity | 1.5 W/mK |
| Volume Resistivity | 1×10 Ohm m |
| Resin | |
| Color, Resin | Blue |
| Hardener | |
| Color, Hardener | Blue: Light Blue |
