Dow Corning® 7920 Die Attach Adhesive

Dow Corning® 7920 Die Attach Adhesive is a are a one-part, black, heat cure, syringe dispensable, DRAM grade, flowable, high strength adhesive with self priming adhesion; silicone for semiconductor.

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Features

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• Low levels of ionic impurities

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• Addition cure chemistry

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• Low modulus

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Dow Corning® brand microelectronics adhesives are designed to meet key criteria in the micro- and optoelectronic packaging industry, including high purity, moisture resistance and thermal and electrical stability. The products deliver outstanding stress relief and high-temperature stability, with excellent primerless adhesion to a wide range of substrate materials and components. These products are ideally suited for microelectronic devices requiring lowmodulus materials, for lead-free solder reflow temperatures (260 °C), or other high-reliability applications. Dow Corning microelectronics adhesives are supplied as convenient, one-part materials, with specific formulations developed for electrical conductivity, electrical insulation or thermal conductivity, all of which cure via heat without byproducts.

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