Description
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
n
-
n
- Snap curable
- Fast flow
- Passes NASA outgassing
n
n
n
MORE FOCUS, MORE PARTNERSHIP, HIGHER PERFOMANCES
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
n
n
n
n
