Description
High performance thermoplastic polyamide designed to meet low pressure moulding process requirements.
TECHNOMELT® PA 646 is a low viscosity, thermoplastic material that allows encapsulation of fragile components without causing any damage, making it the ideal choice for low pressure molding applications. This product is especially suited for applications that require high strength and hardness such as computer connectors and memory sticks. TECHNOMELT PA 646 provides a good balance of high and low temperature performance and does not produce any toxic fumes in process and offers excellent environmental and moisture resistance.
TECHNOMELT PA 646 (e) is particularly suited to applications such as computer connectors and memory sticks where high strength and hardness are desired.
- Easy mouldability
- Good adhesion to a variety of substrates
- Excellent moisture resistance
- Excellent environmental resistance
- Simplified process flow
- Particularly suited to applications such as computer connectors and memory sticks where high strength and hardness are desired
Technical Information
| Technology | Polyamide |
| Product Type | Hotmelt |
| Cure | Physical setting |
| Condition | thermoplastic |
| Components | One-component |
| Application | Molding |
| Color | Black |
