TECHNOMELT PA 646 FOR LOW PRESSURE MOLDING OF PCBs
Because of the increasing demands for circuit board protection in the electronics market, Henkel has initiated its Technomelt products, with low pressure and high speeds that are suitable for sensitive electronic components in manufacturing environments. The technology allows for unique design beyond the form-fit-function of traditional encapsulating materials.
TECHNOMELT® PA 646 BLACK high performance thermoplastic polyamide is designed to meet low pressure moulding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of fragile components without damage. This material produces no toxic fumes in process and provides a good balance of low and high temperature performance.
– Easy mouldability
– Good adhesion to a variety of substrates
– Excellent moisture resistance
– Excellent environmental resistance
– Simplified process flow
– Particularly suited to applications such as computer connectors and memory sticks where high strength and hardness are desired
Creative Engineering is the representative of Technomelt – Henkel in Asia. We are specialised in providing Low Pressure Molding Solutions for manufacturers in Electronics industry. Contact us for further details to bring your business to full potentials!
