BERGQUIST® GAP FILLER TGF 1450 - Thermal Adhesives

BERGQUIST GAP FILLER TGF 1450 is a two-part liquid gap filling system that cures at room temperature to form a strong, mouldable elastomer that is ideal for fragile assemblies. \n \nBERGQUIST® GAP FILLER TGF 1450 is a liquid gap filling material that provides a high level of control due to its high shear thinning characteristics and dries with a low density to reduce final assembly weight. The mixed system remains ultra-conforming with excellent wet-out for near zero interface stress and offers infinite thickness variations without adding stress to the sensitive components during or following assembly. \n

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• Thermal conductivity: 1.5 W/m-K
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• No cure by-products
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• Ultra-conforming with excellent wet-out for near zero interface stress
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• Low density for weight sensitive application
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Density	1.85 g/cm³
Dielectric Constant, ASTM D150 @ 1kHz	6.4
Flame Rating	V-0
Heat Capacity, ASTM E1269	1.0 J/g-K
Mix Ratio, by Volume	1 : 1
Mix Ratio, by Weight	1 : 1
Pot Life, @ 25.0 °C	60.0 min.
Shelf Life	6.0 mon.
Shore Hardness, Thirty second delay value, ASTM D2240 Shore 00	40.0
Storage Temperature	25.0 °C
Thermal Conductivity	1.5 W/mK
Volume Resistivity	1×10 Ohm m
Resin
Color, Resin	Blue
Hardener
Color, Hardener	Blue: Light Blue