
Dow Corning® 340 Heat Sink Compound
Technical Specifications
White, non-flowing, highly filled compound, good thermal conductivity
nDow Corning® 340 Heat Sink Compound is thermal coupling of electrical/electronic devices to heat sinks. High thermal conductivity; low bleed; stable at high temperatures.
nPrimary Use: Thermal coupling of electrical/electronic devices to heat sinks.
nPhysical Form: White, grease-like silicone heavily filled with heat-conductive metal oxides.
nTemperature Range: From -40 to 390°F (-40 to 199°C).
nApplication: Applied to the base and mounting studs of transistors, diodes and siliconcontrolled rectifiers; thermal coupler for many heat sink devices; high-voltage coronasuppressant; nonflammable coating in flyback transformer connections in TV sets.
nContainer Sizes: Tubes, cartridges, pails and drums.
n| Typical Properties | n|
| Color | nWhite | n
| Nonflowable | n|
| Shelf Life | n= 1800 Days | n
| Specific Gravity @ 25C | n= 2.1 | n
| Thermal Conductivity | n= 0.67 Watts per meter K | n
| Thickening System | nMetal Oxide | n
| Viscosity | n= 542000 mPa.s | n
| Worked Penetration | n= 290 mm/10 | n
Categories
n| Products: | nThermally Conductive Materials | n
| Supplier: | nDow Corning (brand) | n
| Industrial applications: | nElectronics Assembly | n
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