Dow Corning® 7920 Die Attach Adhesive

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Dow Corning® 7920 Die Attach Adhesive is a are a one-part, black, heat cure, syringe dispensable, DRAM grade, flowable, high strength adhesive with self priming adhesion; silicone for semiconductor.

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Features

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• Low levels of ionic impurities
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• Addition cure chemistry
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• Low modulus
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Color	Black
Dielectric Constant at 100 Hz	= 2.82
Dielectric Constant at 100 kHz	= 2.81
Dielectric Strength	= 475 volts per mil v/mil
Dielectric Strength (kV/mm)	= 19 kV/mm
Dissipation Factor at 100 Hz	= 0.0011
Dissipation Factor at 100 kHz	< 0.0002
Durometer – Shore A	= 72 Shore A
Elongation	= 25 %
Flowable
Heat Cure	30 Minutes @ 150 Deg C
Shear	= 1000 psi
Specific Gravity @ 25C	= 1.2
Tensile Strength	= 500 psi
Viscosity	= 20000 mPa.s
Volume Resistivity	= 2.1e+015 ohm-centimeters

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Dow Corning® brand microelectronics adhesives are designed to meet key criteria in the micro- and optoelectronic packaging industry, including high purity, moisture resistance and thermal and electrical stability. The products deliver outstanding stress relief and high-temperature stability, with excellent primerless adhesion to a wide range of substrate materials and components. These products are ideally suited for microelectronic devices requiring lowmodulus materials, for lead-free solder reflow temperatures (260 °C), or other high-reliability applications. Dow Corning microelectronics adhesives are supplied as convenient, one-part materials, with specific formulations developed for electrical conductivity, electrical insulation or thermal conductivity, all of which cure via heat without byproducts.

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