Dow corning® DA 6501

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Silicone for semiconductor, die attach / lid seal, microelectronic adhesive; Dow corning® DA 6501 are designed to meet key criteria inthe micro- and optoelectronic packaging industry; including high purity, moisture resistance and thermal and electrical stability; suited for microelectronic devices requiring low-modulus materials, for lead-free solder reflow temperatures (260°C), or other high-reliability applications. One-part materials, translucent, heat cure, flowable, long working time.

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Highly stress relieving. Automated or manual needle dispenser.

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Color	Translucent
Physical Form:	Liquid
Dielectric Constant at 1MHz	= 2.8
Dielectric Strength	= 625 volts per mil v/mil
Durometer – Shore A	= 31 Shore A
Linear CTE	= 300 um/m/Deg C
Shear	= 80 psi
Viscosity	= 7300 mPa.s
Volume Resistivity	= 2.7e+016 ohm-centimeters
Young’s Modulus	= 130 psi

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