DOWSIL™ TC-6015 Thermal Conductive Encapsulant

DOWSIL™ TC-6015 is two part, room temperature curable and heat fast cure, self-adhesion, low specific gravity thermal conductive encapsulant. Developed to meet the demand across industries including renewable energy, energy storage,… \n

Uses

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• PV Inverter
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• Energy Storage System
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• Automotive control unit/EV module
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• High-power modules
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Benefits

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• Thermal conductivity 1.6W/m·K \nLow density \nHigh flowability/rheology control \nMinimal filler settling and no hard caking \nRoom Temperature curable with accelerated heat option \nSelf-adhesion \nExcellent flame retardancy UL 94 V-0; RTI 150 °C \nHigh reliability performance
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