Loctite 3609

' \nChipbonder \n \n \nLoctite 3609 is used for medium to high speed dispense applications. Excellent green strength for large components. Loctite 3609 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Loctite 3609 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section. \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n \n

Chemical Type	Epoxy
Appearance (uncured)	Dark, red viscous gel
Components	One component – requires no mixing
Cure	Heat cure
Application	Surface mount adhesive
Key Substrates	SMD components to PCB
Other Application Areas	Small parts bonding
Dispense Method	Syringe
Dispense Speed	Medium 15,000 -25,000 dots/h
Wet Strength	High

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Typical curing performance

\n \nRecommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C). \n