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Loctite
Loctite 3621
SKU:CE-LOCTIT-0143
Technical Specifications
Chipbonder
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\nHenkel Loctite 3621 is a high performance for ultra high-speed syringe dispense. Recommended product for Dispense Jet. Superior humidity resistance and electrical properties. Room temperature storage capable.
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\nLOCTITE 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Particularly suited where dispense speeds greater than 35,000 dots/h are required. LOCTITE 3621 has been used successfully in lead free wave solder processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section
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\nLOCTITE 3621 is supplied de-aerated in a range of ready-to-use syringes which fit straight into a variety of air pressure/time dispensing systems commonly available.
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| Chemical Type | \nEpoxy | \n
| Appearance (uncured) | \nRed viscous gel (LMS) | \n
| Components | \nOne component -requires no mixing | \n
| Cure | \nHeat cure | \n
| Application | \nSurface mount adhesive | \n
| Key Substrates | \nSMD components to PCB | \n
| Other Application Areas | \nSmall parts bonding | \n
| Dispense Method | \nSyringe | \n
| Dispense Speed | \nVery high 25,000 – 50,000 dots/h | \n
| Wet Strength | \nHigh | \n
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