Pillarhouse Orissa Fusion - Selective Soldering - In-Line

High speed, in-line, multi-platform selective soldering system \n \nIncorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offerings. \n \nThe Orissa Fusion is available in two frame sizes. \n \nFusion Compact \n \nThe three-station cell Fusion 3 Compact – fluxer, pre-heat, solder – can be configured to handle PCBs up to 381mm x 430mm, with a larger PCB handling size available upon request. For increased soldering capability, this same unit can be configured as fluxer/pre-heat and two solder modules. \n \nFusion Standard \n \nThe standard four-station cell Fusion 4 – fluxer, pre-heat, solder, solder – can be configured to handle PCBs up to 381mm x 430mm, with a larger PCB handling size available upon request. For high-speed applications, this same unit can be configured as fluxer/pre-heat and up to three solder modules with as many as five heater options. \n \nEach solder cell can be configured with any of the currently available Pillarhouse solder technologies: custom-dip, multi-dip, Jet-Wave and single point AP down to the patented 1.5mm micronozzle. \n \nEasy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley. \n

Configurations

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Compact Fusion

\nFusion 2 Compact – with Drop-Jet Fluxer, Solder Module (Large PCB Format) includes bottom side slide in / out Pre-heat at Flux station (includes topside IR preheat above solder module) \nFusion 3 Compact – with independent drop jet fluxer, top & bottom I.R. preheat and single solder module (includes topside IR preheat above solder module) \nFusion 3 Compact – with independent drop jet fluxer and twin single solder modules (includes topside IR preheat above both solder modules) \n

Standard Fusion

\nFusion 2 – with independent flux and solder module (includes topside IR preheat above solder module) \nFusion 3 – with independent drop jet fluxer, top & bottom I.R. preheat and single solder module (includes topside IR preheat above solder module) \nFusion 3 – with independent drop jet fluxer and twin single solder modules (includes topside preheat above both solder modules) \nFusion 4 – with independent drop jet fluxer, top & bottom I.R. pre-heat and twin solder modules (includes topside preheat above both solder modules) \nFusion 4 – with independent drop jet fluxer and triple single solder modules (includes topside preheat above all three solder modules) \n

Standard Features

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• Integral PC and machine mounted Titanium monitor
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• In-line motor driven width adjust through feed conveyor
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• Conveyor side clamping
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• DC servo drives with encoders on X, Y & Z axis
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• Inerted Nitrogen system
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• Internal fume extraction
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• Titanium Drop-Jet fluxer
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• Motorised wire feed auto solder top-up & solder level detect
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• Solder wave height measurement and correction system
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• Solder bath coding – identifies correct bath for program
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• Thermal nozzle calibration system using integrated setting camera
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• Auto-nozzle conditioning system
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• Pump rpm
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• Set of AP solder nozzle tips
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• Colour programming camera
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• Process viewing camera
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• Automatic fiducial correction system
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• Multiple level password protection
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• Light stack
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• Flux level sensor
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• PillarCOMM Windows® based ‘Point & Click’ interface
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• Lead-free compatible
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• Day-to-day service kit
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Monitoring Options

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• Flux presence sensor – thermistor style
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• Flux spray, flow and spray & flow
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• O2 ppm
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• Nitrogen flow
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System Options

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• Ultrasonic fluxing
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• Dual Drop-Jet / ultrasonic fluxing
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• Top-side instant IR preheat
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• Bottom-side IR preheat
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• Closed loop pyrometer temperature control
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• Large solder bath for dedicated single dip applications
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• Laser PCB warp correction
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• 1.5mm micro nozzle
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• Solder reel identification
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• Larger PCB handling size
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• Nitrogen generator
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Specifications

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• Height: 1390mm / 55” to 2045mm / 80½”- with light stack
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• Width: 2193mm / 86½“ Compact \n2930mm / 115½” Standard
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• Depth: 1520mm / 60” \n1740mmm / 68½” with flux bottles
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• Board size: 381mm x 460mm / 15”x 18” (Standard frame with 4 stations) \nLarger PCB size available upon request
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• Edge clearance: Above / below 3mm
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• Height clearance: Above / below 40mm nominal, 70mm max.
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• Solder: Most commonly used solder types – including lead-free
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• Solder pot capacity: 20kg standard – 30kg large bath
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• Applicators: AP style – 2.5 – 16mm dia. \nExtended and Jet-Tip nozzles – up to 25mm dia. \nJet-Wave nozzles – up to 25mm width \nSpecial dedicated nozzles available upon request
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• Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
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• X, Y & Z Axis resolution: 0.15mm
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• Repeatability: +/- 0.05mm
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• Nitrogen usage: 40 litres gas/min per bath using single bath with standard AP solder nozzle, 5 bar / 72 psi pressure.
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• Nitrogen purity: 99.995% or better
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• Air supply pressure: 5 bar / 72 psi
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• Power supplies: Three-phase + neutral + PE
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• Voltage: 230 V phase to neutral / 400V phase to phase
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• Frequency: 50/60Hz
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• Power : Machine configuration dependent – contact your local Pillarhouse representative
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• Transport: Motorised conveyor
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• Programming: PillarCOMM Windows® based ‘Point & Click’ interface
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