Pillarhouse Orissa Synchrodex Pro - Selective Soldering - In-Line

Enhanced, flexible, in-line, modular selective soldering system \n \nDesigned as a modular system, the Synchrodex Pro range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high-speed throughput when multiple modules are placed together. \n \nOur Synchrodex Pro is a modular system with a range of in-line equipment offering the ultimate in flexibility, with the ability to upgrade to high-speed throughput when multiple modules are placed together. \n \nThe standard Synchrodex Pro solder module is supplied with an on-board Drop-Jet flux head and offers top side and bottom side slide in/out infra-red pre-heat linked to closed-loop pyrometer control. Pillarhouse can also configure any of our frame sizes to operate as dedicated fluxing and/or I.R./convection heating modules, which, when placed in-line with solder module(s), will significantly increase production throughput. \n \nOur 1600mm solder module offers the ability to process PCBs using either a single or dual-bath operating format. Single bath operation allows for an alternate nozzle process on a single 610mm x 610mm PCB. Dual-bath operation allows for a dual-board, simultaneous, independent nozzle process for increased soldering flexibility on 420mm x 610mm PCBs. Pillarhouse’s uniquely flexible approach is facilitated via a software controlled, mechanical three pin stop arrangement on the conveyor section allowing for either single or dual PCB management. \n \nOur largest PCB handling capability of 1143mm x 610mm can be achieved when using the XL frame size. \n \nThe Synchrodex Pro can be configured with any of the currently available Pillarhouse solder technologies, including single point AP-1, patented 1.5mm micronozzle, Jet-Wave and custom multi-dip. Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley. \n \nThe Synchrodex Pro is controlled by a PC through our next generation PillarCOMM.NET, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, PillarCOMM.NET has an offline package that allows the operator to produce programs independently from the machine using Gerber data. \n

Standard Features

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• Up to  1140mm x 610mm (45” x 24”) board handling with 610mm x 610mm (24″ x 24″) as standard
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• Interchangeable Mechanical or Magnetic solder bath and pump
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• Lead-free solder capability
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• Inerted Nitrogen system
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• Set of AP style solder nozzle tips
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• Automatic nozzle conditioning system
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• Thermal nozzle calibration
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• Solder level detect and motorised wire feeder
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• Wave height correction
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• DC drives on all axes
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• Colour programming camera
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• Automatic fiducial correction
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• Drop Jet fluxer
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• Internal fume extraction
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• Integral PC and monitor
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• New PillarCOMM control software
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• Multiple level password protection
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• IPC-2591 (CFX), Smart Factory ready
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Monitoring Options

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• Flux spray, flow and spray & flow
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• Pump rpm
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• O2 ppm
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• Nitrogen flow
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System Options

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• High definition process viewing camera
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• Top side IR preheat, with closed-loop control
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• Motorised underside IR preheat, at all cell positions
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• Ultrasonic fluxing
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• Dual Drop-Jet / Ultrasonic fluxing
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• Laser-based PCB warp correction
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• Micro nozzle assembly
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• Solder reel identification
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• Nitrogen generator
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Specifications

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• Height: 1391mm / 55” – excluding light stack
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• Width: 958mm / 38“
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• Depth: 2010mm / 79”
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• Board size: Max. – 1140mm x 610mm (45” x 24”) or 610mm x 610mm (24″ x 24″) \nMin. – 102mm x 102mm / 4”x 4”
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• Edge clearance: Above/below 3mm
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• Height clearance: Below 40mm – above 45mm \n100mm – upon request
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• Solder: Most commonly used solder types – including lead-free
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• Solder pot capacity: 20kg standard
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• Applicators: AP style – 2.5 – 16mm dia. \nExtended and Jet-Tip nozzles – up to 25mm dia. \nJet-Wave nozzles – up to 25mm width \n75mm and 150mm Wave nozzle
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• Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
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• Flux tank capacity: 1 litre
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• Fluxer speed: 50 dots/second
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• Deposition size: 4.0-6.0mm / 0.16-0.24”
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• X, Y & Z axis resolution: 0.15mm
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• Repeatability: +/- 0.05mm
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• Nitrogen supply pressure: 5 bar / 72 psi
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• Nitrogen usage: 30-100 litres/min. – solder nozzle configuration dependent
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• Nitrogen purity: 99.995% or better
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• Air supply pressure: 5 bar / 72 psi
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• Air usage: 10 litres/min. / 0.35 CFM
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• Power supplies: Three-phase + neutral + PE
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• Voltage: 230 V phase to neutral / 400V phase to phase
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• Frequency: 50/60Hz
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• Power: Machine configuration dependent – contact your local Pillarhouse representative
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• Transport: Conveyor
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