Learn about thermal interface materials, heat sinks, and cooling solutions.
Fundamentals of Thermal Management
Thermal management has become one of the most critical design challenges as power densities increase while form factors shrink. Every 10°C increase in operating temperature approximately doubles the failure rate.
Thermal Interface Materials (TIMs)
TIMs fill microscopic air gaps between mating surfaces. Performance is characterized by thermal conductivity (W/mK) and thermal impedance (°C-cm²/W).
Heat Sinks and Spreaders
Heat sinks increase effective surface area for convection cooling. Graphite heat spreaders offer anisotropic thermal conductivity for thin applications.
Active Cooling Technologies
For applications requiring heat fluxes exceeding passive cooling, forced air cooling reduces thermal resistance by 50-70%. Liquid cooling provides superior heat removal for high-power applications.
| Material | Conductivity (W/mK) | Application |
|---|---|---|
| Thermal Grease | 1-8 | CPU, GPU |
| Phase Change | 3-7 | High volume |
| Thermal Pad | 1-12 | Gap filling |
- Calculate power dissipation and allowable temperature rise
- Select TIM with appropriate conductivity
Frequently Asked Questions
What is thermal impedance vs conductivity?
Thermal conductivity measures intrinsic ability to conduct heat. Thermal impedance measures total resistance of a TIM interface.
