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thermalheatcoolingTIMelectronics
Heat-Conducting Material
Thermal interface materials (pads, pastes, gap fillers) for effective heat dissipation in electronics and power systems.
Up to 14 W/mK
Thermal Conductivity
-55°C ~ +200°C
Operating Temp
0.25mm - 10mm
Thickness Range
Key Outcomes
- Efficient heat transfer from components to heatsinks
- Low thermal resistance for optimal cooling
- Conformable materials for uneven surfaces
- Long-term stability without pump-out or dry-out
Use Cases
Common applications across industries
CPU/GPU coolingLED thermal managementPower electronicsBattery coolingEV inverters
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